Leadframe package with stable extended leads

ABSTRACT

Embodiments of the present disclosure are directed to leadframes having the cantilevered extension that includes an integral support on the end of the lead nearest the die pad. A support integral to the leadframe allows the support to be built to the proper height to support the cantilevered lead in each package and reduces or eliminates the upward, downward, and side to side deflections caused or allowed by supports built-in to the tooling of the manufacturing equipment. Also, by building the support into the leadframe, the leadframes may be pretaped prior to the die attach and wire bonding steps of the manufacturing process.

BACKGROUND Technical Field

Embodiments of the present disclosure are directed to leadframe packagesand methods of manufacturing and assembling leadless packages.

Description of the Related Art

Leadless, or no lead packages are often utilized in applications inwhich small sized packages are desired. In general, flat leadlesspackages provide a chip scale or near chip-scale encapsulated packagethat includes a planar leadframe. Lands located on a bottom surface ofthe package provide electrical connection to a substrate, such as aprinted circuit board (PCB). The leadless packages can be mounteddirectly on the surface of the PCB using surface mount technology (SMT).

The die in leadframe packages, and in particular quad-flat no leadpackages are wire bonded to the ends of the leads in the package. Thewire bonding process includes using a force and heat to apply the solderand attach a conductive wire to the lead and a semiconductor die. Theleads in the quad flat no lead packages may be cantilevered and theconductive wire is bonded to the free end of the cantilevered lead. Theforce applied to the free end of the lead during the wire bondingprocess causes bending and deformation of the lead. Such bending anddeformation can cause defects in the connection between the conductivewire and the lead and may lead to premature failure of leadframepackages.

The tooling used to manufacture leadframe packages may include anextension that supports the free end of the cantilevered lead during thewire bonding process, but due to variations in manufacturing, theextension may not properly support the cantilevered end of the lead. Forexample, if the support is too high, the lead may be biased upwardduring the wire bonding step, whereas if the support is too low, thelead may be biased downward during the wire bonding step. The extensionson the tooling also do not provide resistance to side to side forces,allowing the cantilevered leads to deform side to side, potentiallycausing misalignment of the lead and the conductive wire and additionaldefects.

Leadframe strips, which are composed of an array of units connected withtie bars, may be pre-taped during the manufacturing and assembly processfor ease of handling and to aid in preventing encapsulant bleed out.When taped, the bottom surfaces of the leadframe strip are adhered to atape, but, when the tooling includes extensions that support thecantilevered leads on a leadframe, the leadframe strip cannot bepre-taped because the tape interferes with the extension's ability tosupport the leads. Thus, when the extension is built into the tooling,the leadframe strip is handled without tape until after the wire bondingstep.

BRIEF SUMMARY

Embodiments of the present disclosure are directed to leadframes havingcantilevered leads that include an integral support on the end of thelead nearest a die pad. A support integral to the leadframe allows thesupport to be built to the correct height to support the cantileveredlead in each package and reduces or eliminates the upward, downward, andside to side deflections caused or allowed by supports built-in to thetooling of the manufacturing equipment. Also, by building the supportinto the leadframe, the leadframes may be pretaped prior to the dieattach and wire bonding steps of the manufacturing process.

After the wire bonding and encapsulation steps in a leadframe packagemanufacturing process, the support structure may be etched away tocreate a cavity beneath the cantilevered end of the lead. This cavitymay remain open or, in some embodiments, the cavity may be refilled orsealed. By etching away or otherwise removing the support, the lead issupported during manufacture of the package, but excess conductivematerial, which may cause shorting and other problems in the finaldevice, is removed, thereby reducing or eliminating the potential forshorting electrical connections in the final package.

In one embodiment disclosed herein a semiconductor package includes adie pad having a die attach surface and a semiconductor die coupled tothe die attach surface of the die pad. The semiconductor package mayalso include a plurality of leads spaced apart from at least one side ofthe die pad. Each of the plurality of leads has a first end and secondend with lands at the second end of each of the plurality of leads. Thefirst ends are nearer the die pad than the second ends. The leadsinclude a cantilevered beam extending from the lands and forming thefirst end of the leads and has a first surface and a second surfaceopposite the first surface. The semiconductor package also includesencapsulation material located over the semiconductor die and a portionof the leads and a cavity formed in the encapsulation material thatexposes a portion of the second surface of the leads.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a schematic illustration of a cross-sectional view of asemiconductor package in accordance with one embodiment.

FIG. 2 is a schematic illustration of a cross-sectional view of asemiconductor package in accordance with one embodiment.

FIG. 3 is a schematic illustration of a cross-sectional view of asemiconductor package in accordance with one embodiment.

FIG. 4A is a schematic illustration of a cross-sectional view of aleadframe in accordance with one embodiment.

FIG. 4B is an isometric view of a leads of a leadframe in accordancewith one embodiment.

FIGS. 5A-5G are cross-sectional views illustrating the packages of FIGS.1-3 being assembled at various stages of manufacture in accordance withone embodiment.

FIG. 6A is a schematic illustration of a bottom view of a package beingformed at the stage shown in FIG. 5D.

FIG. 6B is a schematic illustration of an isometric bottom view of thepackage of FIG. 6B with conductive bumps.

DETAILED DESCRIPTION

FIG. 1 shows a cross-sectional view of a leadframe package 100 a made inaccordance with one embodiment of the disclosure. The leadframe package100 a shows a die pad 102 and two leads 107 located on opposing sides ofthe die pad 102. The die pad 102 has an upper surface 103 and anopposite lower surface 105 and the leads 107 have upper surface 112 anda lower surface 108. The lower surfaces 108 of the leads 107 may also bereferred to as the lands of the package 100 a. The die pad 102 and theleads 107 are made of a conductive material, such as copper or a copperalloy.

The package includes a plurality of leads 107 on each side of the diepad 102. It is to be appreciated that any number of leads may beincluded in the package including one lead on just one side of the diepad 102. In some embodiments, the leads are provided on two sides orfour sides of the die pad. For example, the leads may be on two parallelsides of the package or on four sides of a square or rectangularpackage.

The package 100 a further includes a semiconductor die 104 coupled tothe upper surface 103 of the die pad 102 by an adhesive material 106.The semiconductor die 104 is any semiconductor die configured to sendand/or receive electrical signals. For instance, the semiconductor diemay be an integrated circuit, micro-electromechanical sensor (MEMS), andany other electronic chip. The adhesive material 106 may be any materialconfigured to hold the semiconductor die 104 in place during theassembly process. The adhesive material 106 may be double sided tape,epoxy, glue, or any suitable material for adhering the die 104 to theupper surface 103 of the die pad 102.

The semiconductor die 104 includes conductive pads 116 that areelectrically connected to one or more electrical circuits formed in thesemiconductor die 104, as is well known in the art. Conductive wires 114electrically couple the semiconductor die 104 to the leads 107. Forinstance, a first end of the conductive wire 114 is coupled to aconductive pad 116 of the die 104 and a second end of the conductivewire 114 is coupled to a conductive pad 116 on the upper surface 112 ofthe first end of the lead 107.

Encapsulation material 118 is located over the die 104, die pad 102, andthe leads 107, enclosing the die 104 and the conductive wires 114. Theencapsulation material 118 is also located beneath the leads 107 and thedie pad 102 and forms a portion of bottom surface 111 of the package 100a. The encapsulation material 118 may be any material configured toprovide protection from environmental sources of damage, such ascorrosion, physical damage, moisture damage, or other causes of damageto electrical devices. The encapsulation material 118 may be a moldingcompound that includes one or more of polymer, polyurethane, acrylic,epoxy resin, silicone, or any other suitable material.

In some embodiments, the package 100 a includes a cavity 120 formed inthe encapsulation material 118 below the end of the cantilevered portionof the lead 107. The cavity 120 may be formed via an etching process orother material removal process in which a support 113 that extends fromthe lead 107 is etched away. The support is shown in more detail inFIGS. 4A and 4B. In some embodiments, the support 113 is completelyetched away such that the bottom surface 109 of a cantilevered portion110 of the lead 107 is in a single plane. In some embodiments, thecavity 120 is formed by etching only a portion of the support 113 awaysuch that the support 113 extends from the plane of the lower surface109 of the cantilevered portion 110 of the lead 107, but the support 113does not extend to the bottom surface 111 of the package 100 a.

FIG. 2 shows a cross-sectional view of a leadframe package 100 b made inaccordance with one embodiment of the disclosure. The leadframe package100 b is similar to the leadframe package 100 a and shows a die pad 102and two leads 107 located on opposing sides of the die pad 102. The diepad 102 has an upper surface 103 and an opposite lower surface 105 andthe leads 107 have upper surface 112 and a lower surface 108.

The package includes a plurality of leads 107 on each side of the diepad 102. It is to be appreciated that, similar to the leadframe package100 a, any number of leads may be included in the package including onelead 107 on just one side of the die pad 102 and that in someembodiments, the leads 107 are provided on two sides of the die pad,four sides of the die pad, or any number of sides of the die pad 102.

The package 100 b further includes a semiconductor die 104 coupled tothe upper surface 103 of the die pad 102 by an adhesive material 106.The semiconductor die 104 includes conductive pads 116 that areelectrically connected to one or more electrical circuits formed in thesemiconductor die 104, as is well known in the art. Conductive wires 114electrically couple the semiconductor die 104 to the leads 107.

Encapsulation material 118 is located over the die 104, die pad 102 andthe leads 107 enclosing the die 104 and the conductive wires 114. Theencapsulation material 118 is also located between the leads 107 and thedie pad 102 and forms a bottom surface 111 of the package 100 b.

The package 100 b includes a cavity 120 formed in the encapsulationmaterial 118 below the end of the cantilevered portion of the lead 107.The cavity 120 may be formed via an etching process or other materialremoval process in which a support 113 that extends from the lead 107 isetched away. In some embodiments, the support 113 is completely etchedaway such that the bottom surface of the cantilevered portion 110 of thelead 107 is in a single plane. In some embodiments, the cavity 120 isformed by etching only a portion of the support 113 away such that thesupport 113 extends from the plane of the lower surface of thecantilevered portion 110 of the lead 107, but the support 113 does notextend to the bottom surface 111 of the package 100 b.

In contrast to the embodiment shown in FIG. 1, in the embodiment shownin FIG. 2, the cavity 120 is backfilled to create a sealing member 122a. The material used to fill the cavity 120 and create the sealingmember 122 a may be the same as the encapsulation material 118 and mayinclude a molding compound that includes one or more of polymer,polyurethane, acrylic, epoxy resin, silicone, or any other suitablematerial.

Leaving the cavity 120 unfilled, for example, as shown in FIG. 1, issuitable for many applications, in particular, applications in whichforeign object debris, corrosion and other detrimental environmentaleffects are minimized. In some applications, particularly those in whichdebris, corrosion, and other environmental effects may compromise anexposed surface of the lead, sealing the cavity, which may includebackfilling, may be desirable. For example, by filling the cavity 120with a sealing member 122 a, the formerly exposed portion of the lead107 is sealed, thereby aiding in reducing corrosion and in preventingshort-circuits that may be caused by debris or other contaminants thatwould otherwise enter an unsealed cavity 120.

In some embodiments, for example, as shown in FIG. 2, the bottom surface123 of the sealing member 122 a may be flush with the bottom surface 111of the package 100 b. The bottom surface 123 of the sealing member 122 amay also be flush with the bottom surface of the lands, the bottomsurface 108 of the leads. In this way, the bottom surface 111 of thepackage, the bottom surface 123 of the sealing member 122 a, and thebottom surface 108 of the lead 107 may form a single planar surface.

FIG. 3 shows a cross-sectional view of a leadframe package 100 c made inaccordance with one embodiment of the disclosure. The leadframe package100 c is similar to the leadframe package 100 a and the leadframepackage 100 b and shows a die pad 102 and two leads 107 located onopposing sides of the die pad 102. The die pad 102 has an upper surface103 and an opposite lower surface 105 and the leads 107 have uppersurface 112 and a lower surface 108.

The leadframe package 100 c includes a plurality of leads 107 on eachside of the die pad 102. It is to be appreciated that, similar to theleadframe package 100 a, any number of leads may be included in thepackage including one lead on just one side of the die pad 102, and thatin some embodiments, the leads are provided on two sides of the die pad,four sides of the die pad, or any number of sides of the die pad.

The package 100 c further includes a semiconductor die 104 coupled tothe upper surface 103 of the die pad 102 by an adhesive material 106.The semiconductor die 104 includes conductive pads 116 that areelectrically connected to one or more electrical circuits formed in thesemiconductor die 102, as is well known in the art. Conductive wires 114electrically couple the semiconductor die 104 to the leads 107.

Encapsulation material 118 is located over the die 104, die pad 102 andthe leads 107 enclosing the die 104 and the conductive wires 114. Theencapsulation material 118 is also located between the leads 107 and thedie pad 102 and forms a bottom surface 111 of the package 100 c.

The package 100 c includes a cavity 120 formed in the encapsulationmaterial 118 below the end of the cantilevered portion of the lead 107.The cavity 120 may be formed via an etching process or other materialremoval process in which a support 113 that extends from the lead 107 isetched away. In some embodiments, the support 113 is completely etchedaway such that the bottom surface of the cantilevered portion 110 of thelead 107 is in a single plane. In some embodiments, the cavity 120 isformed by etching only a portion of the support 113 away such that thesupport 113 extends from the plane of the lower surface of thecantilevered portion 110 of the lead 107, but the support 113 does notextend to the bottom surface 111 of the package 100 c.

In contrast to the embodiment shown in FIGS. 1 and 2, in the embodimentshown in FIG. 3, the cavity 120 is backfilled to create a sealing member122 b with an extension 124 that extends beyond the plane of the bottomsurface 111 of the package 100 c. The extension 124 of the sealingmember 122 b extends beyond the plane of the bottom surface 111, adistance D.

The extension 124 aides in separating the bottom surface 111 of thepackage 100 c from a surface of a substrate, such as a printed circuitboard, to which the package 100 c may be attached, for example, when thepackage 100 c is integrated into an electronic device.

The bondline thickness of an electronic device is the thickness of thefiller material, such as solder, that bonds a conductive element, suchas a land, of the package with a conductive element, such as a bond pad,of the substrate to which the package is attached. The bondlinethickness affects the quality and cost of the joint between the packageand the substrate. If the bond line thickness of the solder or otherfiller material is too thick, then filler material is wasted andmanufacturing costs increase, but if the bondline thickness is too thin,then the joint may be weak and susceptible to failure. For example, thejoint may fail due to fatigue caused by varying magnitudes of thermalexpansion between the package and the substrate due to differentcoefficients of thermal expansion between the two parts. Therefore, theextensions 124 set the bondline thickness D at a predictable andrepeatable height that provides for adequate reliability and fatigueresistance. The extensions 124 also reduce variability in the bondlinethickness from part to part and also aid in creating a reliable joint.An example of such a joint formed between the package 100 c and asubstrate 50 is shown in FIG. 5G.

With reference to FIGS. 4A and 4B, an embodiment of bare leadframe 101will now be described. FIG. 4A shows a cross-section of the bareleadframe 101 and FIG. 4B shows an isometric view of the leads 107 ofthe leadframe 101.

FIG. 4A shows a cross-sectional view of a leadframe 101 made inaccordance with one embodiment of the disclosure. The leadframe 101includes a die pad 102 and two leads 107 located on opposing sides ofthe die pad 102. The die pad 102 has an upper surface 103 and anopposite lower surface 105 and the leads 107 have upper surface 112 anda lower surface 108.

The leads 107 include a cantilevered portion 110 that extends from theend of the lead furthest from the die pad 102 and is supported by asupport structure 113 at the end nearest the die pad 102. Thecantilevered portion 110 also includes a lower surface 109 that is in aplane different from the plane of the lower surface 108 that comprisesthe land.

FIG. 4B shows a detailed isometric view of a plurality of leads 107 thatmay be spaced apart from the die pad 102. In the embodiment shown inFIG. 4B, the support structure 113 is a continuous bar that extendsalong the length of the leadframe 101. The support structure 113 extendsfrom and connects the ends of the cantilevered portions 110 of each ofthe plurality of leads 107.

By connecting the ends of multiple leads 107 together, the supportstructure 113 aids in preventing deflection of the cantilevered portion110 of the lead 107 in both up and down directions, up and down in FIG.4A, and in side to side directions, which is in a direction into and outof the page in FIG. 4A.

In some embodiments, the leadframe 101 may have a plurality of supportstructures 113. Each of the plurality of support structures 113, mayextend from and be connected to multiple leads 107.

In some embodiments, a single support structure 113 may extend from asingle, respective, cantilevered portion 110 of a lead 107, such thateach support structure 113 is independent from each other supportstructure 113. Independent support structures do not resist side to sidemovement of the cantilevered portion 110 of a lead 107 in the same waythat connected support structures 113 would, but such support structuresmay require less material etching than connected support structures 113during the removal process described below with respect to FIG. 5D.

FIGS. 5A through 5G illustrate various stages of manufacturing of thepackages 100 a, 100 b, 100 c of FIGS. 1 through 3, in accordance withone or more embodiments disclosed herein.

FIG. 5A shows the leadframe 101 and a portion of an embodiment of amethod of producing a leadframe package. The leadframe 101 is aconductive material, such as metal, and in some embodiments is made ofcopper or a copper alloy. The leadframe 101 is formed to have a die pad102 and leads 107. As shown in FIG. 5A, tape 130 is applied to thebottom surfaces 105, 115, 108 of the leadframe 101. In some embodimentsthe leadframe 101 may be one of many leadframes connected together in astrip to which the tape 130 is applied.

FIG. 5B shows another portion of an embodiment of method of producing aleadframe package. As shown in FIG. 5B, an adhesive material 106 isapplied to the top surface 103 of the die pad 102. After application ofthe adhesive material 106, a die 104 is attached to the die pad 102 ofthe leadframe 101.

After installation of the die 104, conductive wire 114 is attachedbetween the die and the leads 107. A first end of the conductive wire114 is attached to conductive pad 116 on the die 104 and a second end ofthe conductive wire 114 is attached to the conductive pad 116 at the endof an adjacent lead 107. During this process, the support structure 113supports the cantilevered portion 110 of the lead 107 and aids inreducing or preventing deflection of the cantilevered portion 110 of thelead 107.

As shown in FIG. 5C, after installation of the conductive wire 114,encapsulation material 118 is formed over the leadframe 101 such thatthe encapsulation material 118 surrounds the die 104, the conductivewires 114, and the upper surfaces 112 and the lower surface 109 of theleads 107. The encapsulation material 118 may be formed on the leadframe101 by conventional techniques, for example by a molding process, and insome embodiments is hardened during a curing step.

As shown in FIG. 5D, after the encapsulation material 118 is formed overthe leadframe 101, the tape 130 may be removed from the bottom surfacesof the leadframe 101. Also, shown in FIG. 5D is the removal of thesupport structure 113 and formation of the cavity 120. The cavity 120 isformed using standard semiconductor processing techniques, includingpatterning with light sensitive materials and etching techniques. Insome embodiments, for example, wherein the support structure 113 extendsfrom and connects the cantilevered portions 110 of a plurality of leads107, the cavity may be an elongated trench. See for example FIGS. 6A and6B illustrating a single, continuous cavity 121 in the encapsulationmaterial 18 that exposes the first ends of the plurality the leads 107at the second surfaces of the cantilevered beams and exposes surfaces 19of the encapsulation material 18 to an environment outside thesemiconductor package. FIG. 6B shows the package with conductive bumps54. In an embodiment wherein each lead 107 has an independent supportstructure 113, multiple independent cavities 120 may be formed, each oneof the multiple independent cavities being beneath a lead 107. In someembodiments, the leadframe package 100 a may be complete after formationof the cavities 120 and may be subsequently coupled to a substrate, suchas a printed circuit board.

In FIG. 5E, the cavities 120 are sealed with a sealing member 122 a thathas a bottom surface in the same plane as the bottom surface 111 of theleadframe package 100 b and also in the same plane as the bottom surface108, the land, of the lead 107. In some embodiments, the leadframepackage 100 b may be complete after formation of the cavities 120 andmay be subsequently coupled to a substrate, such as a printed circuitboard.

In FIG. 5F, the cavities 120 are sealed with a sealing member 122 b thatincludes an extension 124 that extends a distance beyond the plane ofthe bottom surface 111 of the leadframe package 100 c, and also adistance beyond the plane of the bottom surface 108, the land, of thelead 107. In some embodiments, the leadframe package 100 c may becomplete after formation of the cavities 120 and may be subsequentlycoupled to a substrate, such as a printed circuit board, for example, asshown in FIG. 5G.

In FIG. 5G the leadframe package 100 c is coupled to the substrate 50via filler material 54, which may be solder. The lands 108 of theleadframe package 100 c may be coupled to the conductive pads 52 of thesubstrate 50 via the solder. In this way, electronic signals from thedie 104 may pass through the conductive wires 114, then through theleads 107, the filler material 54, and into the substrate 50.

The bondline thickness of the filler material 54 may be approximatelyequal to the distance D, which represents the distance. The extension124 extends beyond the plane of the bottom surface 111 of the leadframepackage 100 c.

The various embodiments described above can be combined to providefurther embodiments. All of the U.S. patents, U.S. patent applicationpublications, U.S. patent applications, foreign patents, foreign patentapplications and non-patent publications referred to in thisspecification and/or listed in the Application Data Sheet areincorporated herein by reference, in their entirety. Aspects of theembodiments can be modified, if necessary to employ concepts of thevarious patents, applications and publications to provide yet furtherembodiments.

These and other changes can be made to the embodiments in light of theabove-detailed description. In general, in the following claims, theterms used should not be construed to limit the claims to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all possible embodiments along with the full scopeof equivalents to which such claims are entitled. Accordingly, theclaims are not limited by the disclosure.

The various embodiments described above can be combined to providefurther embodiments. All of the U.S. patents, U.S. patent applicationpublications, U.S. patent applications, foreign patents, foreign patentapplications and non-patent publications referred to in thisspecification and/or listed in the Application Data Sheet areincorporated herein by reference, in their entirety. Aspects of theembodiments can be modified, if necessary to employ concepts of thevarious patents, applications and publications to provide yet furtherembodiments.

These and other changes can be made to the embodiments in light of theabove-detailed description. In general, in the following claims, theterms used should not be construed to limit the claims to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all possible embodiments along with the full scopeof equivalents to which such claims are entitled. Accordingly, theclaims are not limited by the disclosure.

The invention claimed is:
 1. A method of forming a semiconductorpackage, the method comprising: attaching a semiconductor die to asurface of a die pad; electrically coupling the semiconductor die to aplurality of leads, the plurality of leads being along a same side ofthe die pad and spaced apart from the die pad, the plurality of leadshaving first and second ends, wherein lands are at the second ends ofthe plurality of leads and wire bonding surfaces are at the first endsof the plurality of leads, wherein integral extensions are betweenadjacent first ends of the plurality of leads and spaced apart from thedie pad, wherein the integral extensions support the adjacent first endsof the plurality of leads, the first ends being nearer the die pad thanthe second ends; encapsulating the semiconductor die; and afterencapsulating, removing the integral extensions and portions of thefirst ends of the plurality of leads below the wire bonding surfaces. 2.The method of claim 1, wherein removing the integral extensions andportions of the first ends of the plurality of leads forms a cavity, themethod further comprising sealing the cavity.
 3. The method of claim 2,wherein sealing the cavity comprises sealing the cavity with epoxy. 4.The method of claim 2, wherein sealing the cavity comprises sealing thecavity with silicone.
 5. The method of claim 2, wherein sealing thecavity comprises sealing the cavity with a sealing structure thatextends a first distance from a bottom surface of the lands.
 6. Themethod of claim 5, wherein the solder has a bond line thicknessapproximately equal to the first distance.
 7. The method of claim 1,further comprising coupling a printed circuit board to the lands withsolder.
 8. The method of claim 7, wherein a sealing structure contactsthe printed circuit board.
 9. A method comprising: coupling asemiconductor die to a die pad; electrically coupling the semiconductordie to a plurality of leads by conductive wires, the plurality of leadsbeing at a same side of the die pad and having first and second ends,respectively, the first ends being closer to the die pad than the secondends, wherein adjacent first ends of the plurality of leads face a firstside surface of the die pad and are coupled together by a support,wherein the support and the plurality of leads are spaced apart from thefirst side surface of the die pad by a space; encapsulating thesemiconductor die and conductive wires with an encapsulation material,the encapsulation material filling the space between the die pad andsupport and plurality of leads; and after encapsulating, removing thesupport and portions of the first ends of the plurality of leads belowthe conductive wires to form a cavity.
 10. The method of claim 9,further comprising filling the cavity with a molding material.
 11. Themethod of claim 10, wherein filling the cavity comprises filling thecavity so that the molding material extends beyond an outer surface ofthe encapsulation material.
 12. The method of claim 10, wherein theencapsulation material is a same material as the molding material. 13.The method of claim 9, further comprising coupling the second ends ofthe plurality of leads to a printed circuit board by conductive balls.14. The method of claim 9, wherein the support is below the first endsof the plurality of leads and between adjacent first ends of theplurality of leads, wherein removing the support comprises etching thesupport to form the cavity.
 15. The method of claim 9, wherein thecavity has a bottom surface formed by surfaces of the first ends of theplurality of leads and a surface of the molding material, the cavityincluding walls formed by the molding material.
 16. A method comprising:coupling a semiconductor die to a die pad; electrically coupling thesemiconductor die to a plurality of leads by conductive wires, theplurality of leads having first ends and second ends, respectively,wherein adjacent first ends of the plurality of leads are coupledtogether by support portions, the first ends facing the die pad;encapsulating the semiconductor die and conductive wires with a moldingmaterial; and etching portions of the first ends of the plurality ofleads and the support portions to form a cavity, the cavity including abottom surface formed by surfaces of the first ends of the plurality ofleads and a surface of the molding material, the cavity including wallsformed by the molding material.
 17. The method of claim 16, furthercomprising filling the cavity.
 18. The method of claim 17, whereinfilling the cavity comprises filling the cavity with an encapsulationmaterial.
 19. The method of claim 18, wherein filling the cavitycomprises filling the cavity so that the encapsulation material extendsbeyond a surface of the molding material.
 20. The method of claim 17,further comprising coupling the second ends of the plurality of leads toa substrate using conductive balls.